JPH0723967Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0723967Y2 JPH0723967Y2 JP7924289U JP7924289U JPH0723967Y2 JP H0723967 Y2 JPH0723967 Y2 JP H0723967Y2 JP 7924289 U JP7924289 U JP 7924289U JP 7924289 U JP7924289 U JP 7924289U JP H0723967 Y2 JPH0723967 Y2 JP H0723967Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal film
- insulating film
- layer metal
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 19
- 239000010410 layer Substances 0.000 claims description 88
- 239000002184 metal Substances 0.000 claims description 54
- 238000009966 trimming Methods 0.000 claims description 37
- 239000011229 interlayer Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 description 109
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 5
- 230000002411 adverse Effects 0.000 description 4
- 230000004075 alteration Effects 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7924289U JPH0723967Y2 (ja) | 1989-07-04 | 1989-07-04 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7924289U JPH0723967Y2 (ja) | 1989-07-04 | 1989-07-04 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0320452U JPH0320452U (en]) | 1991-02-28 |
| JPH0723967Y2 true JPH0723967Y2 (ja) | 1995-05-31 |
Family
ID=31623226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7924289U Expired - Lifetime JPH0723967Y2 (ja) | 1989-07-04 | 1989-07-04 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0723967Y2 (en]) |
-
1989
- 1989-07-04 JP JP7924289U patent/JPH0723967Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0320452U (en]) | 1991-02-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |